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NVIDIA moves AI chip memory controller into HBM stack; NVHBM memory frees 25% more compute

NVIDIA NVHBM moves the HBM memory controller off the AI accelerator die and buries it inside the memory stack itself, freeing up to 25% more compute silicon per chip. The August 31 NVIDIA-MediaTek ...
heise online

Stack memory with 36 GByte per chip: HBM4 mass production from October 2025

The fifth generation of High Bandwidth Memory is currently in use as HBM3E. After SK Hynix delivered samples of the upcoming HBM4 generation with 12 layers of 24 Gbit each back in March, mass ...
Network World

Micron joins HBM4 race with 36GB 12-high stack, eyes AI and data center dominance

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
ExtremeTech

Samsung Announces 12-Layer Stack of HBM3e DRAM at 36GB

Samsung has come out of the gate strong in 2024 by announcing it's developed a 12-layer version of the most cutting-edge high-bandwidth memory (HBM) available today, HBM3e. The development will move ...
TechSpot

Samsung reveals next-gen memory with stacked HBM and 400-layer NAND

In brief: Samsung is adding a new set of memory technologies to its AI strategy, using wafer bonding and 3D stacking to push bandwidth, density, and energy efficiency beyond what current ...